CT scanning offers a comprehensive, three-dimensional view of electronic assemblies without the need for disassembly. This advanced capability is essential for pinpointing critical defects that could compromise device performance or safety, including:
- Misalignments and placement errors of components
- Solder joint integrity and porosity
- Wire bond quality and anomalies
- Presence of foreign materials
- Uniformity of conformal coatings
- Integrity of circuit board traces and vias
- Structural integrity of casings and encapsulations
- Early signs of thermal stress or component failure
Watch our free Webinar (left) to learn more about how industrial CT can help ensure the reliability of sophisticated electronics.
Apple Thunderbolt 4 (USB-C) Pro Cable
Industrial CT enables high-resolution inspection of all critical components of this Apple Thunderbolt 4 (USB-C) Pro Cable, including the blind and buried vias on the 9-layer PCBA.
Integrated Circuit (IC)
The Microfocus Neptune allows precise inspection of wire to pin bonding and die placement inside this IC.
BGA Component
Industrial CT allows for precise visualization and quantification of BGA and solder joint porosity that could lead to electronic failure.