CT scanning offers a comprehensive, three-dimensional view of electronic assemblies without the need for disassembly. This advanced capability is essential for pinpointing critical defects that could compromise device performance or safety, including:
- Misalignments and placement errors of components
- Solder joint integrity and porosity
- Wire bond quality and anomalies
- Presence of foreign materials
- Uniformity of conformal coatings
- Integrity of circuit board traces and vias
- Structural integrity of casings and encapsulations
- Early signs of thermal stress or component failure
Watch our free Webinar (left) to learn more about how industrial CT can help ensure the reliability of sophisticated electronics.
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Apple Thunderbolt 4 (USB-C) Pro Cable
Industrial CT enables high-resolution inspection of all critical components of this Apple Thunderbolt 4 (USB-C) Pro Cable, including the blind and buried vias on the 9-layer PCBA.
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Integrated Circuit (IC)
The Microfocus Neptune allows precise inspection of wire to pin bonding and die placement inside this IC.
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BGA Component
Industrial CT allows for precise visualization and quantification of BGA and solder joint porosity that could lead to electronic failure.